The earner of this badge can create an interposer device, import the ASIC and HBM devices, and perform top-level integration and placement of the devices in Integrity 3D-IC System Planner. They will also be able to perform netlist creation, signal assignement, and bump and TSV creation for the interposer. Lastly, they will also be able to push both the ASIC and interposer designs to Integrity 3D-IC Layout for implementation.

• Type Validation
• Level Intermediate